About credit card sized SBC

The initial goal in creating the Raspberry Pi credit card sized, Linux-based Single Board Computer (SBC) – targeted primarily at education – was to develop a response to the decline of students engaging with computer science and related engineering disciplines. Our desire was to reverse the trend of children becoming consumers rather than creators. The following case study follows the hardware development process from an early failure, initial prototypes, and through to the finished production design.




refer to :http://embedded-computing.com/articles/case-card-sized-sbc/

MSC presents a Starter Kit

A new starter kit for COM Express(tm) modules with AMD Embedded R-Series Accelerated Processing Unit (APU) is now available. The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express(tm) Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules.


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refer to:http://smallformfactors.com/news/msc-kit-com-expresstm-type-modules/#at_pco=cfd-1.0

See you at ESEC Japan 2013 !

ACROSSER Technology announces our participation in 2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.





At the 2013 ESEC, Acrosser will highlight its latest endeavors on 2 major applications: networking and gaming. For networking, the latest Rackmount product from Acrosser, the ANR-IB75N1, will be on display during the entire event. As for gaming applications, Acrosser will exhibit its new All-in-One Gaming Board, AMB-A55EG1. The board features great computing and graphic performance, and high compatibility on multiple operation systems. In addition, Acrosser also stresses its focus on other product lines, including Single Board Computers and In Vehicle Computer AIV-HM76V0FL.

We look forward to turning your dreams into reality at the 2013 ESEC!
We cordially invite you to visit our booth and discover our outstanding products!

New Product information：

(Networking Appliance)
ANR-IB75N1/A/B


http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1／A／B/Networking-Appliance-ANR-IB75N1／A／B.html



(Gaming Platform)
AMB-A55EG1





http://www.acrosser.com/Products/Gaming-Platform/All-in-One-Gaming-Board/AMB-A55EG1/AMD-Embedded-G-Series-AMB-A55EG1.html

Contact：
http://www.acrosser.com/inquiry.html

About Static analysis...

When it comes to software development, the old adage is best spun in a slightly different way: better "early" than never. Accordingly, static analysis can help those developing in Java to stay one step ahead of potential coding problems.

Today’s software development teams are under immense pressure; the market demands high-quality, secure releases at a constantly increasing pace while security threats become more and more sophisticated. Considering the high cost of product failures and security breaches, it is more important than ever to address these risks throughout the software development process. Potential problems need to be spotted early to prevent release delays or, worse, post-release failures.

...

refer to: http://embedded-computing.com/articles/static-helps-manage-risk-java/ 

2013 the Embedded Systems Expo and Conference (ESEC) in Tokyo

2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.

New Product information：

(Networking Appliance)
ANR-IB75N1/A/B

http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1／A／B/Networking-Appliance-ANR-IB75N1／A／B.html



(Gaming Platform)
AMB-A55EG1





http://www.acrosser.com/Products/Gaming-Platform/All-in-One-Gaming-Board/AMB-A55EG1/AMD-Embedded-G-Series-AMB-A55EG1.html

Next-generation FPGAs

FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.


refer to :
http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/

The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU

Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.

The ubiquitous use of sensors in our smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.

Most analog sensor systems comprise three key elements: the analog sensor that measures a specific form of energy, the micro controller (MCU) that processes the digital equivalent of the sensor’s signal, and between them is the Analog Front End (AFE) system (Figure 1). The AFE receives the sensor’s signal and converts/transforms it for the MCU to use, as in most cases the sensor output signals cannot be directly interfaced to an MCU.

Figure 1: The Analog Front End (AFE) converts and conditions analog sensor signals for use by the MCU.

The challenge associated with current AFE design approaches is the time-consuming trial-and-error tuning process, and the lack of flexibility and scalability to support multiple sensors from a single AFE. Moreover, many AFEs do not account for sensor drift or adjust for sensor trimming during production, which directly reduces the quality of the sensor. However, new fully configurable AFE technology is enabling designers to overcome these hurdles.

1.The importance of the AFE

2.Challenges to AFE designs

3.Let’s examine each of these challenges.

4.Configurable AFE eases calibration trial and error

5.Configurable AFE provides scalability

6.A software-supported design approach

7.Simplifying the burden of AFE designs

refer to : http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0