2013年4月23日 星期二

2013 the Embedded Systems Expo and Conference (ESEC) in Tokyo


2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.

2013年4月16日 星期二

Next-generation FPGAs

Panel PC, Embedded PC, Industrial PC
FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.


refer to :

http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/

2013年4月9日 星期二

The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU



Embedded PC, in vehicle pc, Single Board Computer

Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.


The ubiquitous use of sensors in our smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.
Most analog sensor systems comprise three key elements: the analog sensor that measures a specific form of energy, the micro controller (MCU) that processes the digital equivalent of the sensor’s signal, and between them is the Analog Front End (AFE) system (Figure 1). The AFE receives the sensor’s signal and converts/transforms it for the MCU to use, as in most cases the sensor output signals cannot be directly interfaced to an MCU.
Embedded PC, in vehicle pc, Single Board Computer

Figure 1: The Analog Front End (AFE) converts and conditions analog sensor signals for use by the MCU.


The challenge associated with current AFE design approaches is the time-consuming trial-and-error tuning process, and the lack of flexibility and scalability to support multiple sensors from a single AFE. Moreover, many AFEs do not account for sensor drift or adjust for sensor trimming during production, which directly reduces the quality of the sensor. However, new fully configurable AFE technology is enabling designers to overcome these hurdles.
1.The importance of the AFE

2.Challenges to AFE designs

3.Let’s examine each of these challenges.
4.Configurable AFE eases calibration trial and error

5.Configurable AFE provides scalability

6.A software-supported design approach


7.Simplifying the burden of AFE designs