2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.
Industrial fanless Panel PC (PPC), Human Machine Interface (HMI) and Industrial touch screen pc/Stainless 工业无风扇平板电脑(PPC),人机界面(HMI)和工业触摸屏PC/不锈钢面板PC系列包括英特尔凌动,赛扬,酷睿2,酷睿i。 NEMA4,IP65外壳采用5.7的尺寸“,8”,10.4“,12.1”,15“,17”和21“触摸屏。这些平板电脑是专门为工业平板电脑应用设计,如工业自动化HMI,车辆,信息亭,数字标牌,饮料和医疗。这些工业平板电脑的突出特点包括平面面板,不锈钢,防水,超薄。开架式工业电脑也被设计灵活性。
2013年4月23日 星期二
2013年4月16日 星期二
Next-generation FPGAs
FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.
refer to :
http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/
refer to :
http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/
2013年4月9日 星期二
The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU
Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.
The ubiquitous use of sensors in our smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.
Most analog sensor systems comprise three key elements: the analog sensor that measures a specific form of energy, the micro controller (MCU) that processes the digital equivalent of the sensor’s signal, and between them is the Analog Front End (AFE) system (Figure 1). The AFE receives the sensor’s signal and converts/transforms it for the MCU to use, as in most cases the sensor output signals cannot be directly interfaced to an MCU.
The challenge associated with current AFE design approaches is the time-consuming trial-and-error tuning process, and the lack of flexibility and scalability to support multiple sensors from a single AFE. Moreover, many AFEs do not account for sensor drift or adjust for sensor trimming during production, which directly reduces the quality of the sensor. However, new fully configurable AFE technology is enabling designers to overcome these hurdles.
1.The importance of the AFE
2.Challenges to AFE designs
3.Let’s examine each of these challenges.
4.Configurable AFE eases calibration trial and error
5.Configurable AFE provides scalability
6.A software-supported design approach
7.Simplifying the burden of AFE designs
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